ASAP Aviation Procurement is pleased to announce that part number MMBD7000LT1 of NSN 5961-01-414-9170 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number MMBD7000LT1 is a Semiconductor Device Diode manufactured by On Semiconductor Corporation under CAGE Code 5V1P1. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote. In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. MMBD7000LT1 On Semiconductor Corporation is in stock.
Are you interested in learning more about part number MMBD7000LT1? If so, feel free to contact us by phone at +1-714-705-4780, or by email at sales@asap-aviationprocurement.com.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-414-9170 Item PartTypeName: SEMICONDUCTOR DEVICE,DIODE | 5961 | 014149170 | 0 | N | A | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | A | A | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
MMBD7000L | 5 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | PLASTIC" |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-236AB" |
AXGY | MOUNTING METHOD | TERMINAL" |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON" |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS" |
CTQX | CURRENT RATING PER CHARACTERISTIC | 200.00 MILLIAMPERES SOURCE CUTOFF CURRENT PRESET AND 500.00 MILLIAMPERES FORWARD CURRENT, AVERAGE PRESET" |
CTRD | POWER RATING PER CHARACTERISTIC | 225.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET" |
TTQY | TERMINAL TYPE AND QUANTITY | 3 BONDING PAD" |
ABBH | INCLOSURE MATERIAL | PLASTIC" |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-236AB" |
AXGY | MOUNTING METHOD | TERMINAL" |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON" |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS" |
CTQX | CURRENT RATING PER CHARACTERISTIC | 200.00 MILLIAMPERES SOURCE CUTOFF CURRENT PRESET AND 500.00 MILLIAMPERES FORWARD CURRENT, AVERAGE PRESET" |
CTRD | POWER RATING PER CHARACTERISTIC | 225.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET" |
TTQY | TERMINAL TYPE AND QUANTITY | 3 BONDING PAD" |
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AS9120B and ISO 9001:2015 |
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Aviation Suppliers Association Member |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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