BFG55 by Philips Semiconductors Inc with NSN 5961014217013 - Submit a Quote
| Part No. : BFG55 | Manufacturer : Philips Semiconductors Inc | NSN : 5961-01-421-7013 |
| Item Name : Transistor | CAGE Code : 18324 | FSC : 5961 Semiconductor Devices and Associated Hardware |
ASAP Aviation Procurement is pleased to announce that part number BFG55 of NSN 5961014217013 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number BFG55 is a transistor manufactured by philips semiconductors inc under CAGE Code 18324. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. BFG55 philips semiconductors inc is in stock.
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NSN Information for Part Number BFG55 with NSN 5961-01-421-7013, 5961014217013
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-421-7013 Item Description: Transistor | 5961 | 014217013 | 0 | N | A | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | A | A | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Bfg55 | 5 | 9 | 5 |
Characteristics Data of NSN 5961-01-421-7013, 5961014217013MRC Criteria Characteristic ABHP OVERALL LENGTH 6.7 MILLIMETERS MAXIMUM ABMK OVERALL WIDTH 7.3 MILLIMETERS MAXIMUM ALAZ JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION SOT-223 CTMZ III SEMICONDUCTOR MATERIAL SILICON CTQX CURRENT RATING PER CHARACTERISTIC 150.00 MILLIAMPERES ALL PRIMARIES MAXIMUM FEAT SPECIAL FEATURES JUNCTION PATTERN ARRANGEMENT: PNP ABBH INCLOSURE MATERIAL PLASTIC ABKW OVERALL HEIGHT 1.8 MILLIMETERS MAXIMUM ALAS INTERNAL CONFIGURATION JUNCTION CONTACT AXGY MOUNTING METHOD TERMINAL CTMZ SEMICONDUCTOR MATERIAL SILICON CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 18.0 NOMINAL COLLECTOR TO EMITTER VOLTAGE/STATIC/BASE OPEN CTRD POWER RATING PER CHARACTERISTIC 1.0 WATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET TTQY TERMINAL TYPE AND QUANTITY 4 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 6.7 MILLIMETERS MAXIMUM |
| ABMK | OVERALL WIDTH | 7.3 MILLIMETERS MAXIMUM |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | SOT-223 |
| CTMZ | III SEMICONDUCTOR MATERIAL | SILICON |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 150.00 MILLIAMPERES ALL PRIMARIES MAXIMUM |
| FEAT | SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: PNP |
| ABBH | INCLOSURE MATERIAL | PLASTIC |
| ABKW | OVERALL HEIGHT | 1.8 MILLIMETERS MAXIMUM |
| ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT |
| AXGY | MOUNTING METHOD | TERMINAL |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 18.0 NOMINAL COLLECTOR TO EMITTER VOLTAGE/STATIC/BASE OPEN |
| CTRD | POWER RATING PER CHARACTERISTIC | 1.0 WATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET |
| TTQY | TERMINAL TYPE AND QUANTITY | 4 PRINTED CIRCUIT |
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