CC8126-3W by Philips Semiconductors Inc with NSN 5962012836850 - Submit a Quote
Part No. : CC8126-3W | Alternate P/N: CC81263W | Manufacturer : Philips Semiconductors Inc | NSN : 5962-01-283-6850 |
Item Name : Microcircuit Memory | CAGE Code : 18324 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number CC8126-3W of NSN 5962012836850 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number CC8126-3W is a microcircuit memory manufactured by philips semiconductors inc under CAGE Code 18324. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. CC8126-3W philips semiconductors inc is in stock.
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NSN Information for Part Number CC8126-3W with NSN 5962-01-283-6850, 5962012836850
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-283-6850 Item Description: Microcircuit Memory | 5962 | 012836850 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Cc8126-3w | 5 | 9 | 5 |
Characteristics Data of NSN 5962-01-283-6850, 5962012836850MRC Criteria Characteristic ABMK OVERALL WIDTH 0.940 INCHES MINIMUM AND 0.960 INCHES MAXIMUM ADAQ BODY LENGTH 0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM ADAU BODY HEIGHT 0.055 INCHES MINIMUM AND 0.085 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS CBBL FEATURES PROVIDED BIPOLAR AND MONOLITHIC AND W/ENABLE AND 3-STATE OUTPUT AND PROGRAMMABLE CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 10 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZER MEMORY DEVICE TYPE ROM TTQY TERMINAL TYPE AND QUANTITY 16 FLAT LEADS
MRC | Criteria | Characteristic |
---|---|---|
ABMK | OVERALL WIDTH | 0.940 INCHES MINIMUM AND 0.960 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.055 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | BIPOLAR AND MONOLITHIC AND W/ENABLE AND 3-STATE OUTPUT AND PROGRAMMABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
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