P4C1298L-35 by Pyramid Semiconductor Corp with NSN 5962013529453 - Submit a Quote
| Part No. : P4C1298L-35 | Alternate P/N: P4C1298L35 | Manufacturer : Pyramid Semiconductor Corp | NSN : 5962-01-352-9453 |
| Item Name : Microcircuit Memory | CAGE Code : 3DTT2 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number P4C1298L-35 of NSN 5962013529453 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number P4C1298L-35 is a microcircuit memory manufactured by pyramid semiconductor corp under CAGE Code 3DTT2. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. P4C1298L-35 pyramid semiconductor corp is in stock.
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NSN Information for Part Number P4C1298L-35 with NSN 5962-01-352-9453, 5962013529453
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-352-9453 Item Description: Microcircuit Memory | 5962 | 013529453 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| P4c1298l-35 | 5 | 1 | 5 |
Characteristics Data of NSN 5962-01-352-9453, 5962013529453MRC Criteria Characteristic ADAQ BODY LENGTH 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM ADAT BODY WIDTH 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM ADAU BODY HEIGHT 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION COUNTERMEASURES SET AN/ALQ-135 CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND STATIC OPERATION CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK CQZP INPUT CIRCUIT PATTERN 23 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR C-11 MIL-M-38510 CTQX CURRENT RATING PER CHARACTERISTIC 120.00 MILLIAMPERES MAXIMUM SUPPLY CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 70.00 NANOSECONDS MAXIMUM DELAY TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 28 FLAT LEADS CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS CZEP CAPITANCE RATING PER CHARACTERISTIC 11.00 INPUT PICOFARADS MAXIMUM AND 11.00 OUTPUT PICOFARADS MAXIMUM CZER MEMORY DEVICE TYPE RAM
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | COUNTERMEASURES SET AN/ALQ-135 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND STATIC OPERATION |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQZP | INPUT CIRCUIT PATTERN | 23 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-11 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES MAXIMUM SUPPLY |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM DELAY |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 FLAT LEADS |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 11.00 INPUT PICOFARADS MAXIMUM AND 11.00 OUTPUT PICOFARADS MAXIMUM |
| CZER | MEMORY DEVICE TYPE | RAM |
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