CF68011HFG by Texas Instrument Inc with NSN 5962014160409 - Submit a Quote
| Part No. : CF68011HFG | Manufacturer : Texas Instrument Inc | NSN : 5962-01-416-0409 |
| Item Name : Microcircuit Memory | CAGE Code : 01295 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number CF68011HFG of NSN 5962014160409 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number CF68011HFG is a microcircuit memory manufactured by texas instrument inc under CAGE Code 01295. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. CF68011HFG texas instrument inc is in stock.
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NSN Information for Part Number CF68011HFG with NSN 5962-01-416-0409, 5962014160409
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-416-0409 Item Description: Microcircuit Memory | 5962 | 014160409 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Cf68011hfg | 5 | 9 | 3 |
Characteristics Data of NSN 5962-01-416-0409, 5962014160409MRC Criteria Characteristic ADAQ BODY LENGTH 2.540 INCHES MAXIMUM" ADAT BODY WIDTH 2.540 INCHES MAXIMUM" ADAU BODY HEIGHT 0.103 INCHES MAXIMUM" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" AGAV END ITEM IDENTIFICATION F-16" CBBL FEATURES PROVIDED BIPOLAR AND BURN IN, MIL-STD-883, CLASS B AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMED AND TESTED TO MIL-STD-883" CQSJ INCLOSURE MATERIAL CERAMIC" CQSZ INCLOSURE CONFIGURATION LEADED CHIP CARRIER" CQWX OUTPUT LOGIC FORM BIPOLAR METAL-OXIDE SEMICONDUCTOR" CRTL CRITICALITY CODE JUSTIFICATION CBBL" CWSG TERMINAL SURFACE TREATMENT SOLDER" CXCY PART NAME ASSIGNED BY CONTROLLING AGENCY MICROCIRCUIT, ASIC, DIGITAL, SYMBOL GENERATOR" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM INPUT AND 5.0 VOLTS MAXIMUM INPUT AND -0.5 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE" CZER MEMORY DEVICE TYPE PAL" FEAT SPECIAL FEATURES 112,000 GATE COUNT;TI TBG1000 0.8 MICRON BI-CMOS TECHNOLOGY;FOUR FUNCTIONS-BUS INTERFACE, SYMBOL GENERATOR, SYMBOL OCCLUSION AND SYMBOL SCAN CONVERSION FUNCTIONS;MAX CLOCK FREQUENCY IS 40 MHZ" TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." TTQY TERMINAL TYPE AND QUANTITY 196 BEAM LEAD" ADAQ BODY LENGTH 2.540 INCHES MAXIMUM" ADAT BODY WIDTH 2.540 INCHES MAXIMUM" ADAU BODY HEIGHT 0.103 INCHES MAXIMUM" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" AGAV END ITEM IDENTIFICATION F-16" CBBL FEATURES PROVIDED BIPOLAR AND BURN IN, MIL-STD-883, CLASS B AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMED AND TESTED TO MIL-STD-883" CQSJ INCLOSURE MATERIAL CERAMIC" CQSZ INCLOSURE CONFIGURATION LEADED CHIP CARRIER" CQWX OUTPUT LOGIC FORM BIPOLAR METAL-OXIDE SEMICONDUCTOR" CRTL CRITICALITY CODE JUSTIFICATION CBBL" CWSG TERMINAL SURFACE TREATMENT SOLDER" CXCY PART NAME ASSIGNED BY CONTROLLING AGENCY MICROCIRCUIT, ASIC, DIGITAL, SYMBOL GENERATOR" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM INPUT AND 5.0 VOLTS MAXIMUM INPUT AND -0.5 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE" CZER MEMORY DEVICE TYPE PAL" FEAT SPECIAL FEATURES 112,000 GATE COUNT;TI TBG1000 0.8 MICRON BI-CMOS TECHNOLOGY;FOUR FUNCTIONS-BUS INTERFACE, SYMBOL GENERATOR, SYMBOL OCCLUSION AND SYMBOL SCAN CONVERSION FUNCTIONS;MAX CLOCK FREQUENCY IS 40 MHZ" TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." TTQY TERMINAL TYPE AND QUANTITY 196 BEAM LEAD"
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 2.540 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 2.540 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.103 INCHES MAXIMUM" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| AGAV | END ITEM IDENTIFICATION | F-16" |
| CBBL | FEATURES PROVIDED | BIPOLAR AND BURN IN, MIL-STD-883, CLASS B AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMED AND TESTED TO MIL-STD-883" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER" |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR" |
| CRTL | CRITICALITY CODE JUSTIFICATION | CBBL" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, ASIC, DIGITAL, SYMBOL GENERATOR" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 5.0 VOLTS MAXIMUM INPUT AND -0.5 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE" |
| CZER | MEMORY DEVICE TYPE | PAL" |
| FEAT | SPECIAL FEATURES | 112,000 GATE COUNT;TI TBG1000 0.8 MICRON BI-CMOS TECHNOLOGY;FOUR FUNCTIONS-BUS INTERFACE, SYMBOL GENERATOR, SYMBOL OCCLUSION AND SYMBOL SCAN CONVERSION FUNCTIONS;MAX CLOCK FREQUENCY IS 40 MHZ" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 196 BEAM LEAD" |
| ADAQ | BODY LENGTH | 2.540 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 2.540 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.103 INCHES MAXIMUM" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| AGAV | END ITEM IDENTIFICATION | F-16" |
| CBBL | FEATURES PROVIDED | BIPOLAR AND BURN IN, MIL-STD-883, CLASS B AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMED AND TESTED TO MIL-STD-883" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER" |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR" |
| CRTL | CRITICALITY CODE JUSTIFICATION | CBBL" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, ASIC, DIGITAL, SYMBOL GENERATOR" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 5.0 VOLTS MAXIMUM INPUT AND -0.5 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE" |
| CZER | MEMORY DEVICE TYPE | PAL" |
| FEAT | SPECIAL FEATURES | 112,000 GATE COUNT;TI TBG1000 0.8 MICRON BI-CMOS TECHNOLOGY;FOUR FUNCTIONS-BUS INTERFACE, SYMBOL GENERATOR, SYMBOL OCCLUSION AND SYMBOL SCAN CONVERSION FUNCTIONS;MAX CLOCK FREQUENCY IS 40 MHZ" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 196 BEAM LEAD" |
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