49A0295-000 by Unisys Corp with NSN 5962010949069 - Submit a Quote
| Part No. : 49A0295-000 | Alternate P/N: 49A0295000 | Manufacturer : Unisys Corp | NSN : 5962-01-094-9069 |
| Item Name : Microcircuit Memory | CAGE Code : 4S536 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number 49A0295-000 of NSN 5962010949069 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number 49A0295-000 is a microcircuit memory manufactured by unisys corp under CAGE Code 4S536. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. 49A0295-000 unisys corp is in stock.
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NSN Information for Part Number 49A0295-000 with NSN 5962-01-094-9069, 5962010949069
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-094-9069 Item Description: MICROCIRCUIT,MEMORY | 5962 | 010949069 | N | |||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 49A0295-000 | 3 | 9 | 5 |
Characteristics Data of NSN 5962-01-094-9069, 5962010949069MRC Criteria Characteristic CZEQ Time Rating Per Chacteristic 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AFJQ Storage Temp Range -55.0/+150.0 DEG CELSIUS CZER Memory Device Type ROM CQZP Input Circuit Pattern 10 INPUT ADAT Body Width 0.275 INCHES MINIMUM AND 0.310 INCHES MAXIMUM CQSJ Inclosure Material CERAMIC TEST Test Data Document 21101-49A0295 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) MRC Decoded Requirement Clear Text Reply TTQY Terminal Type And Quantity 16 PRINTED CIRCUIT CWSG Terminal Surface Treatment SOLDER CBBL Features Provided HERMETICALLY SEALED AND MONOLITHIC AND DYNAMIC AND W/STROBE AND W/ENABLE ADAQ Body Length 0.780 INCHES MINIMUM AND 0.820 INCHES MAXIMUM AEHX Maximum Power Dissipation Rating 1.25 WATTS ADAU Body Height 0.185 INCHES MAXIMUM AFGA Operating Temp Range +0.0/+70.0 DEG CELSIUS CQSZ Inclosure Configuration DUAL-IN-LINE CQWX Output Logic Form N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC CZEN Voltage Rating And Type Per Characteristic -0.5 VOLTS MINIMUM POWER SOURCE AND 25.0 VOLTS MAXIMUM POWER SOURCE CZZZ Memory Capacity UNKNOWN
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEQ | Time Rating Per Chacteristic | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AFJQ | Storage Temp Range | -55.0/+150.0 DEG CELSIUS |
| CZER | Memory Device Type | ROM |
| CQZP | Input Circuit Pattern | 10 INPUT |
| ADAT | Body Width | 0.275 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| CQSJ | Inclosure Material | CERAMIC |
| TEST | Test Data Document | 21101-49A0295 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| MRC | Decoded Requirement | Clear Text Reply |
| TTQY | Terminal Type And Quantity | 16 PRINTED CIRCUIT |
| CWSG | Terminal Surface Treatment | SOLDER |
| CBBL | Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND DYNAMIC AND W/STROBE AND W/ENABLE |
| ADAQ | Body Length | 0.780 INCHES MINIMUM AND 0.820 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 1.25 WATTS |
| ADAU | Body Height | 0.185 INCHES MAXIMUM |
| AFGA | Operating Temp Range | +0.0/+70.0 DEG CELSIUS |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| CQWX | Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 25.0 VOLTS MAXIMUM POWER SOURCE |
| CZZZ | Memory Capacity | UNKNOWN |
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