NSN 5962-01-380-5333 of Microcircuit Set - Parts Details
Alternative NSN: 5962013805333 |
Item Name: Microcircuit Set |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013805333 |
NCB Code: USA (01) |
Manufacturers: Agilent Technologies Inc , Hewlett Packard Co |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 08757-60098 under NSN 5962-01-380-5333 of Microcircuit Set manufactured by Agilent Technologies Inc, Hewlett Packard Co.
Federal Supply Class of NSN 5962-01-380-5333 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-380-5333, 5962013805333
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Part No Manufacturer Item Name QTY RFQ 08757-60098 Agilent Technologies Inc microcircuit set Avl RFQ 08757-60098 Hewlett Packard Co microcircuit set Avl RFQ
Characteristics Data of NSN 5962013805333MRC Criteria Characteristic ADAQ BODY LENGTH 1.625 INCHES NOMINAL ALL MEMORY" ADAT BODY WIDTH 0.562 INCHES NOMINAL ALL MEMORY" ADAU BODY HEIGHT 0.187 INCHES NOMINAL ALL MEMORY" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS ALL MEMORY" ASDD COMPONENT FUNCTION RELATIONSHIP MATCHED" CBBL FEATURES PROVIDED PROGRAMMED" CQSJ INCLOSURE MATERIAL CERAMIC ALL MEMORY" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE ALL MEMORY" CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC ALL MEMORY" CRHL UNABLE TO DECODE UNABLE TO DECODE" CSWJ UNABLE TO DECODE UNABLE TO DECODE" CWSG TERMINAL SURFACE TREATMENT SOLDER ERR-100 ERR-100" CZEM MICROCIRCUIT DEVICE TYPE AND QUANTITY 2 MEMORY" CZEQ TIME RATING PER CHACTERISTIC 200.00 NANOSECONDS MAXIMUM ACCESS ALL MEMORY" CZER MEMORY DEVICE TYPE PROM ERR-100 ERR-100" TTQY TERMINAL TYPE AND QUANTITY 32 PRINTED CIRCUIT ALL MEMORY" ADAQ BODY LENGTH 1.625 INCHES NOMINAL ALL MEMORY" ADAT BODY WIDTH 0.562 INCHES NOMINAL ALL MEMORY" ADAU BODY HEIGHT 0.187 INCHES NOMINAL ALL MEMORY" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS ALL MEMORY" ASDD COMPONENT FUNCTION RELATIONSHIP MATCHED" CBBL FEATURES PROVIDED PROGRAMMED" CQSJ INCLOSURE MATERIAL CERAMIC ALL MEMORY" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE ALL MEMORY" CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC ALL MEMORY" CRHL UNABLE TO DECODE UNABLE TO DECODE" CSWJ UNABLE TO DECODE UNABLE TO DECODE" CWSG TERMINAL SURFACE TREATMENT SOLDER ERR-100 ERR-100" CZEM MICROCIRCUIT DEVICE TYPE AND QUANTITY 2 MEMORY" CZEQ TIME RATING PER CHACTERISTIC 200.00 NANOSECONDS MAXIMUM ACCESS ALL MEMORY" CZER MEMORY DEVICE TYPE PROM ERR-100 ERR-100" TTQY TERMINAL TYPE AND QUANTITY 32 PRINTED CIRCUIT ALL MEMORY"
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.625 INCHES NOMINAL ALL MEMORY" |
ADAT | BODY WIDTH | 0.562 INCHES NOMINAL ALL MEMORY" |
ADAU | BODY HEIGHT | 0.187 INCHES NOMINAL ALL MEMORY" |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS ALL MEMORY" |
ASDD | COMPONENT FUNCTION RELATIONSHIP | MATCHED" |
CBBL | FEATURES PROVIDED | PROGRAMMED" |
CQSJ | INCLOSURE MATERIAL | CERAMIC ALL MEMORY" |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE ALL MEMORY" |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC ALL MEMORY" |
CRHL | UNABLE TO DECODE | UNABLE TO DECODE" |
CSWJ | UNABLE TO DECODE | UNABLE TO DECODE" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER ERR-100 ERR-100" |
CZEM | MICROCIRCUIT DEVICE TYPE AND QUANTITY | 2 MEMORY" |
CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM ACCESS ALL MEMORY" |
CZER | MEMORY DEVICE TYPE | PROM ERR-100 ERR-100" |
TTQY | TERMINAL TYPE AND QUANTITY | 32 PRINTED CIRCUIT ALL MEMORY" |
ADAQ | BODY LENGTH | 1.625 INCHES NOMINAL ALL MEMORY" |
ADAT | BODY WIDTH | 0.562 INCHES NOMINAL ALL MEMORY" |
ADAU | BODY HEIGHT | 0.187 INCHES NOMINAL ALL MEMORY" |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS ALL MEMORY" |
ASDD | COMPONENT FUNCTION RELATIONSHIP | MATCHED" |
CBBL | FEATURES PROVIDED | PROGRAMMED" |
CQSJ | INCLOSURE MATERIAL | CERAMIC ALL MEMORY" |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE ALL MEMORY" |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC ALL MEMORY" |
CRHL | UNABLE TO DECODE | UNABLE TO DECODE" |
CSWJ | UNABLE TO DECODE | UNABLE TO DECODE" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER ERR-100 ERR-100" |
CZEM | MICROCIRCUIT DEVICE TYPE AND QUANTITY | 2 MEMORY" |
CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM ACCESS ALL MEMORY" |
CZER | MEMORY DEVICE TYPE | PROM ERR-100 ERR-100" |
TTQY | TERMINAL TYPE AND QUANTITY | 32 PRINTED CIRCUIT ALL MEMORY" |