ASAP Aviation Procurement is pleased to announce that part number MMZ2012S601A of NSN 5999-01-578-9923 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number MMZ2012S601A is a Core Shielding Bead manufactured by Tdk Semiconductor Corporation under CAGE Code 4VEU3. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote. In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. MMZ2012S601A Tdk Semiconductor Corporation is in stock.
Are you interested in learning more about part number MMZ2012S601A? If so, feel free to contact us by phone at +1-714-705-4780, or by email at sales@asap-aviationprocurement.com.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5999-01-578-9923 Item Description: CORE-SHIELDING BEAD | 5999 | 015789923 | P | |||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| MMZ2012S601A | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| FEAT | Special Features | CHIP BEAD (IMPEDER), MMZ SERIES OFFERS 4 CONSTRUCTION MATERIALS; SIZE STANDARIZED FOR USE BY AUTOMATIC ASSEMBLY EQUIPMENT; NO PREFERRED ORIENTATION; EITHER FLOW OR REFLOW SOLDERING METHODS CAN BE USED DUE TO ELECTROPLATING OF THE TERMINAL ELECTRODES; HIGH RELIABILITY DUE TO AN ENTIRELY MONOLITHIC STRUCTURE; CLOSED MAGNETIC CIRCUIT STRUCTURE ALLOWS HIGH-DENSITY INSTALLATION WHILE PREVENTING CROSSTALK BETWEEN CIRCUITS; LOW DC RESISTANCE STRUCTURE OF ELECTRODE PREVENTS WASTEFUL ELECTRIC POWER CONSUMPTION; CONTAINS NO LEAD AND ALSO SUPPORT LEAD-FREE SOLDERING; CONFORMING TO ROHS DIRECTIVE |
| CXCY | Part Name Assigned By Controlling Agency | CHIP BEADS(SMD) FOR SIGNAL LINE |
| MRC | Decoded Requirement | Clear Text Reply |
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AS9120B and ISO 9001:2015 |
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Aviation Suppliers Association Member |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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