SMJ2532-45JDM by Texas Instrument Inc with NSN 5962012787239 - Submit a Quote
Part No. : SMJ2532-45JDM | Alternate P/N: SMJ253245JDM | Manufacturer : Texas Instrument Inc | NSN : 5962-01-278-7239 |
Item Name : Microcircuit Memory | CAGE Code : 01295 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number SMJ2532-45JDM of NSN 5962012787239 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number SMJ2532-45JDM is a microcircuit memory manufactured by texas instrument inc under CAGE Code 01295. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. SMJ2532-45JDM texas instrument inc is in stock.
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NSN Information for Part Number SMJ2532-45JDM with NSN 5962-01-278-7239, 5962012787239
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-278-7239 Item Description: MICROCIRCUIT,MEMORY | 5962 | 012787239 | N | |||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
B | ||||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
SMJ2532-45JDM | 2 | 1 | 5 |
Characteristics Data of NSN 5962-01-278-7239, 5962012787239MRC Criteria Characteristic ADAQ BODY LENGTH 1.290 INCHES MAXIMUM" ADAT BODY WIDTH 0.600 INCHES MAXIMUM" ADAU BODY HEIGHT 0.210 INCHES MAXIMUM" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" CBBL FEATURES PROVIDED HERMETICALLY SEALED AND PROGRAMMABLE AND MONOLITHIC AND ERASABLE" CQSJ INCLOSURE MATERIAL CERAMIC" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE" CQWX OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC" CQZP INPUT CIRCUIT PATTERN 13 INPUT" CRHL UNABLE TO DECODE UNABLE TO DECODE" CSWJ UNABLE TO DECODE UNABLE TO DECODE" CWSG TERMINAL SURFACE TREATMENT SOLDER" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 6.0 VOLTS MAXIMUM POWER SOURCE" CZEQ TIME RATING PER CHACTERISTIC 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" CZER MEMORY DEVICE TYPE ROM" TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT" ADAQ BODY LENGTH 1.290 INCHES MAXIMUM" ADAT BODY WIDTH 0.600 INCHES MAXIMUM" ADAU BODY HEIGHT 0.210 INCHES MAXIMUM" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" CBBL FEATURES PROVIDED HERMETICALLY SEALED AND PROGRAMMABLE AND MONOLITHIC AND ERASABLE" CQSJ INCLOSURE MATERIAL CERAMIC" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE" CQWX OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC" CQZP INPUT CIRCUIT PATTERN 13 INPUT" CRHL UNABLE TO DECODE UNABLE TO DECODE" CSWJ UNABLE TO DECODE UNABLE TO DECODE" CWSG TERMINAL SURFACE TREATMENT SOLDER" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 6.0 VOLTS MAXIMUM POWER SOURCE" CZEQ TIME RATING PER CHACTERISTIC 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" CZER MEMORY DEVICE TYPE ROM" TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT"
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM" |
ADAT | BODY WIDTH | 0.600 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM" |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND MONOLITHIC AND ERASABLE" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC" |
CQZP | INPUT CIRCUIT PATTERN | 13 INPUT" |
CRHL | UNABLE TO DECODE | UNABLE TO DECODE" |
CSWJ | UNABLE TO DECODE | UNABLE TO DECODE" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE" |
CZEQ | TIME RATING PER CHACTERISTIC | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
CZER | MEMORY DEVICE TYPE | ROM" |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT" |
ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM" |
ADAT | BODY WIDTH | 0.600 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM" |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND MONOLITHIC AND ERASABLE" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC" |
CQZP | INPUT CIRCUIT PATTERN | 13 INPUT" |
CRHL | UNABLE TO DECODE | UNABLE TO DECODE" |
CSWJ | UNABLE TO DECODE | UNABLE TO DECODE" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE" |
CZEQ | TIME RATING PER CHACTERISTIC | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
CZER | MEMORY DEVICE TYPE | ROM" |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT" |
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